XZZ SAM S21 ULTRA Middle Layer Planting Tin Platform
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The XZZ SAM S21 ULTRA Middle Layer Planting Tin Platform is a professional-grade repair tool designed specifically for Samsung Galaxy S21 ULTRA motherboard maintenance. It provides precise alignment for middle-layer solder ball planting and BGA reballing, ensuring accurate chip positioning during motherboard repair. Manufactured from high-quality stainless steel, this durable platform is ideal for mobile repair technicians and is compatible with magnetic positioning bases such as the XZZ C6 Universal Magnetic Base.
এসকেইউ:
প্রকারভেদ: SAMSUNG
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Key Features
- Specifically designed for Samsung Galaxy S21 ULTRA motherboard repair
- Precision middle-layer solder ball planting
- High-accuracy BGA reballing platform
- Premium stainless steel construction
- Heat-resistant, durable, and reusable
- Accurate chip and PCB alignment
- Ideal for motherboard rework and chip replacement
- Compatible with XZZ C6 magnetic base
- Professional-grade mobile repair tool
- Easy to use for repair technicians
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