YCS‑H03 Pro Circular PCB Fixture – High‑Temp Tempered Glass IC/CPU Soldering & Repair Holder

1,850৳ 1,950৳

Attribute	Details
Model	YCS‑H03 Pro
Type	Universal circular PCB/motherboard fixture
Platform Compatibility	iPhone, Android phones/tablets, smartwatches; works with BGA chips, CPUs, NAND ICs
Size	Diameter approx. 104 mm; Height ~22 mm; Depth ~90 mm
Net Weight	~211 g (0.61 kg)
Material / Surface	High-strength metal base + high‑temperature‑resistant tempered glass panel—easy to clean and withstands hot air rework heat
Heat Resistance	Tempered glass panel prevents warping or melting under high‑temperature soldering
Base Type	Non‑slip, stable during soldering (hot air, reballing, glue removal)
Design & Adjustment	360° circular rotation; coaxial travel movement means no direction/twist adjustments needed when scraping tin or removing glue
Clamping Mechanism	Concealed threaded rod design avoids rosin/oil adhesion; suited for chip scraping without obstructing blades or tools
Use Cases	IC/CPU soldering – BGA reballing, NAND flash, chip glue/tin scraping, motherboard cleaning
Included	1 × YCS‑H03 Pro fixture; some sellers include a warranty (e.g., 12 months)

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✨ Enhanced Product Description

The YCS‑H03 Pro Circular PCB Fixture is a premium universal motherboard holder designed for high-precision IC and CPU soldering tasks. Its reinforced metal frame and high-temperature tempered glass surface ensure durability and easy cleaning under hot air rework. The fixture supports 360° rotation and coaxial movement, allowing unobstructed chip scraping, glue/tin removal, and BGA reballing. With a non-slip base and concealed adjustment mechanisms, it guarantees stable, secure clamping without tool interference—compatible with iPhone, Android, tablet, and smartwatch motherboards. Lightweight and portable, yet robust enough for professional and hobbyist repair shops.