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SM6450 BGA Reballing Stencil for Snapdragon 6Gen1 Honor X50 CPU DDR4X PM6150C PM6450 PM7250B UFS BGA153 SC8546 QLN5030
SM6450 BGA Reballing Stencil for Snapdragon 6Gen1 Honor X50 CPU DDR4X PM6150C PM6450 PM7250B UFS BGA153 SC8546 QLN5030

SM6450 BGA Reballing Stencil for Snapdragon 6Gen1 Honor X50 CPU DDR4X PM6150C PM6450 PM7250B UFS BGA153 SC8546 QLN5030

Brand: AMAOE

180৳ 240৳

SM6450 BGA Reballing Stencil for Snapdragon 6Gen1 Honor X50 CPU DDR4X PM6150C PM6450 PM7250B UFS BGA153 SC8546 QLN5030  

(Available)
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Categories:IC REBALLING PLATE/STENCIL, HUAWEI, QUALCOMM

Tags:BGA153, PM7250B, SM6450, QLN5030, SC8546, PM6450, PM6150C, Honor X50 CPU DDR4X


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