WL PREHEATER HT007

🔧 WL HT007 Intelligent Mainboard Layered Soldering Station

Product Overview:
The WL HT007 is a high-performance preheating soldering station designed for iPhone motherboard repairs, including models from iPhone X to iPhone 15 Pro Max. It features intelligent temperature control, real-time monitoring, and a layered heating system to ensure precise and safe soldering.

✅ Features & Benefits:

• Layered Heating Technology: Focuses heat on the central column of the motherboard to prevent damage to sensitive components.
• Real-Time Temperature Monitoring: Microcomputer-controlled system displays dynamic temperature, ensuring precise soldering conditions.
• Dual Heating System: Combines resistance and electromagnetic induction heating for efficient and uniform heat distribution.
• Customizable Settings: Allows user-defined open channels, timer functions, and hibernation mode for flexible operation.
• ESD-Safe Design: Protects against electrostatic discharge, safeguarding delicate electronic components.
• Wide Compatibility: Supports a range of iPhone models, making it versatile for various repair tasks.

🛠️ Ideal Applications:

• Motherboard Reballing: Efficiently heats the motherboard for BGA reballing processes.
• Tin Planting: Facilitates tin planting on motherboard pads for component replacement.
• Layered Soldering: Enables safe and precise soldering of multi-layered motherboards.
• Component Removal: Assists in the safe removal of components without damaging the motherboard.
  
  
  Tags:
  WL HT007, iPhone motherboard soldering station, preheating soldering station, iPhone repair tools, BGA reballing station, tin planting tool, layered soldering platform, ESD-safe soldering station