XZZ SAM S21 Middle Layer Planting Tin Platform
1,550৳
The XZZ SAM S21 Middle Layer Planting Tin Platform is a precision repair tool specially designed for Samsung Galaxy S21 motherboard rework. It enables accurate middle-layer solder ball planting and BGA reballing, ensuring perfect alignment for reliable repair results. Made from premium stainless steel with high machining accuracy, this platform is ideal for professional mobile repair technicians and works seamlessly with compatible magnetic positioning bases.
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Categories: SAMSUNG
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Key Features
- Designed specifically for Samsung Galaxy S21 motherboard repair
- Precision middle-layer solder ball planting
- High-accuracy BGA reballing platform
- Premium stainless steel construction
- Durable, heat-resistant, and reusable
- Ensures precise chip alignment
- Suitable for professional mobile repair technicians
- Compatible with magnetic positioning bases like the XZZ C6
- Ideal for motherboard rework and chip replacement
- Lightweight and easy to use
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