WL PREHEATER 13/13PRO MAX

🔧 WL HT007 Pre-Heating Soldering Station for iPhone 13 & 13 Pro Max

Overview:
The WL HT007 is a high-performance pre-heating soldering station designed specifically for the iPhone 13 and 13 Pro Max motherboards. Engineered to facilitate safe and efficient motherboard repairs, this platform utilizes advanced heating technology to ensure optimal performance.


✅ Features & Benefits:

• Layered Heating Technology: Focuses heat on the central column of the motherboard to prevent damage to sensitive components.

• Precise Temperature Control: Digital thermostat allows users to set and maintain optimal temperatures for safe disassembly.

• Middle Layer Separator Compatibility: Includes a separator to assist in cleanly detaching the screen and back layers without causing structural damage.

• Robust Build Quality: Constructed with durable, heat-resistant materials to ensure longevity and safety during repeated use.

• Portability: Sleek design offers ample workspace while maintaining portability for technicians on the go.

🛠️ Ideal Applications:

• Motherboard Reballing: Efficiently heats the motherboard for BGA reballing processes.

• Tin Planting: Facilitates tin planting on motherboard pads for component replacement.

• Layered Soldering: Enables safe and precise soldering of multi-layered motherboards.

• Component Removal: Assists in the safe removal of components without damaging the motherboard.

📦 Package Includes:

• 1x WL HT007 Pre-Heating Soldering Station

• 1x iPhone 13/13 Pro Max middle-layer separator

• Power cable

• User manual

Tags:
WL HT007, iPhone 13 pre-heating platform, motherboard repair tool, BGA reballing station, ESD-safe heating platform, iPhone 13 repair equipment, layered soldering platform